Wide Area Reversible Adhesive for In-Space Assembly


Meyer J. L., Lan P., Bakir M., Jasiuk I., Economy J.

Macromolecular Materials and Engineering, cilt.305, sa.7, 2020 (SCI-Expanded, Scopus)

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 305 Sayı: 7
  • Basım Tarihi: 2020
  • Doi Numarası: 10.1002/mame.202000006
  • Dergi Adı: Macromolecular Materials and Engineering
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Applied Science & Technology Source, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Anahtar Kelimeler: adhesives, assembly, in-space assembly, materials for space, reversible bonding
  • Ankara Yıldırım Beyazıt Üniversitesi Adresli: Evet

Özet

The design of future space structures may anticipate a greater need for in-space assembly due to larger planned space structures and changes in mission profiles over their operational lifetimes. A rapid and reversible adhesive coating over the structure’s surface would allow additional components to be bonded at any arbitrary time in the future. A scalable wide-area reversible adhesive utilizing a high glass transition thermoset polymer possessing thermally exchangeable bonds can serve as an enabling technology for in-space assembly. Coatings of aromatic thermosetting copolyesters can be deposited on aluminum and titanium coupons, which bond when heated to 400 °C with the counterpart surfaces under pressure. Reversibility over multiple cycles is shown within a dynamic mechanical analyzer with the limiting constraint being the necessity of nondelaminatory (cohesive) debonding of the bonded coupons. Bonded coupons can sustain a thermal cycle spanning the representative temperatures in low earth orbit under tension with no failure. A localized rapid heating method amenable for in-space assembly can be used to bond titanium coupons using induction heating with a bonding time of 40 s.