Adhesion properties of CeO2 films produced from different precursors using sol-gel process
Materials Science and Engineering B: Solid-State Materials for Advanced Technology, cilt.261, 2020 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 261
- Basım Tarihi: 2020
- Doi Numarası: 10.1016/j.mseb.2020.114774
- Dergi Adı: Materials Science and Engineering B: Solid-State Materials for Advanced Technology
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
- Anahtar Kelimeler: Adhesion, CeO2 thin films, Failure mode, Sol-gel, Tensile testing, YBa2Cu3O7 (YBCO)
- Ankara Yıldırım Beyazıt Üniversitesi Adresli: Evet
Özet
© 2020CeO2 films were deposited on Ni and Ag tapes by sol–gel process using nitrate, ammonium nitrate, colloidal, alkoxide, acetate, and oxalate based precursors and a detailed characterization of adhesion properties were performed in relation with structural features. The structural, microstructural and adhesion properties of the films heat-treated at 500 °C for 60 min in air were determined via XRD, ESEM and a mini tensile testing machine. The results showed that homogeneous films with cubic structure can be deposited on Ni and Ag tapes. The microstructure of the CeO2 films could also be tailored by altering precursor type, solvent, chelating agent and modifying liquid. The CeO2 joint samples with Ag tapes prepared from cerium(III)2,4 pentanedionate based solution exhibited the best adhesive properties because of polymeric sol and gel. The observed results in joint samples indicate a correlation between the failure types and the choice of solution from which CeO2 films prepared.