Ceramics International, 2025 (SCI-Expanded)
Commercial glass/cordierite/nano hexagonal boron nitride (hBN) filler composites were successfully fabricated for low-temperature co-fired ceramics applications. These composites meet the requirements such as densification temperatures below 950 °C, high thermal conductivity for effective heat dissipation, a thermal expansion coefficient matched to silicon for enhanced reliability, and a low dielectric constant for high signal transmission speed. Densification temperatures for all composites were ≤875 °C, attributed to the viscous sintering of the glass matrix. The number of closed pores increased with the hBN content, limiting the expected property improvements. However, very low apparent porosity (0.75 %) glass/cordierite/hBN (10 wt%) composite achieved a thermal expansion coefficient of 2.17 ppm/°C between 25 and 200 °C, a thermal conductivity of 1.72 W/m·K at 25 °C and a dielectric constant (loss) of 5.01 (0.0067) at 5 MHz. These properties are comparable to commercial low-temperature co-fired ceramics products.